Grounding and Bonding Study Guide

Grounding and bonding are related but perform different functions. The central study concept is understanding normal-current paths versus fault-current return paths.

CEC grounding and bonding study commonly begins in Section 10, then requires verification of the exact rule, definitions, equipment conditions, and jurisdictional amendments that apply.

• Bonding provides an intentionally low-impedance metallic fault-current path.
• The grounded conductor and bonding path are not interchangeable downstream.
• Avoid unintended parallel neutral-current paths.
• Trace the complete fault-current path before choosing an answer.
• Verify Code-dependent conductor sizes and installation requirements in current legal material.